AMD北京研发中心招聘实习生，该职位有机会接触并学习AMD最新的显卡技术和融合技术, 请感兴趣的同学务必以“应聘physical design intern_姓名_学校_年级_专业_每周可实习天数_实习时长)” 为标题， 把简历发送到Maggie1.Zhang@amd.com以及Jina.Wang3@amd.com。请在来信正文中写明应聘理由



Job Description:
Work with global Front-End design team and physical design team for large scale ASIC chip physical implementation. Focus on physical design of deep sub-micron GPU chips including block level (full chip) floor planning, timing closure, place&route, physical verification etc
Job Requirement:
1. Bachelor with 1+ years of industrial experience in ASIC design
2. Hands on experience in large scale ASIC chip physical design
3. Knowledgeable in all aspects of deep submicron ASIC design flow
4. Successfully gone through several complete product development cycles
5. Demonstrate strong leadership and work well with cross-functional teams
6. Good listening, writing and speaking English
7. Good communication skills, strong interpersonal skills and the flexibility
8. Dedicated, hard working and good team player
9. Familiar with Back-End (physical design) EDA tools
10. Familiar with Front-End EDA tools is a plus
11. Familiar with Unix/Linux environment and good at scripts
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FROM 210.13.97.*