Job Title:
      CDMA mechanical Design Intern      

Job Objective:
To be responsible for mechanical design, 3D modeling and create detailed drawing. Prototype assembly and fit check, update drawings as needed.

Responsibilities:
•    Pro/E design modeling and drawing creation
•    RF /power/fiber interconnect specification review.
•    Coordinate the prototype build status review meeting with suppliers


Qualifications & Requirements:
1.    Qualifications - BSc Mechanical Engineering (MSc candidate preferred)
2.    Knowledge of manufacturing materials and processes
3.    Knowledge of EMI containment techniques
4.    Strong creative and analytical capabilities
5.    Strong thermal analysis skills and experience using CFD tools  
6.    Developing physical prototypes
7.    Performing preliminary thermal and structural analysis using FEA and CFD tools
8.    Developing high-level physical design concepts
9.    Developing of innovative thermal management solutions
10.    3-D modeling of design concepts using Pro/Engineer
11.    Performing cabling and interconnect analysis
12.    Designing for manufacturability, installability, repairability




Job Title:
      CDMA Power Design Intern      

Job Objective:
To be responsible for designer verification test, documentation update (specification and testing reports, etc)

Responsibilities:
•    Write general specification and designer verification test plan
•    Execute designer testing in hardware lab and write the DVT report.
•    Review schematic design using Cadence
•    Coordinate design review meeting with OEM suppliers.


Qualifications & Requirements:

1.    Bachelor degree of EE (MSc candidate preferred)
2.    Must fluent in English speaking and proficient in English writing.
3.    Good skills using Oscilloscope, multi meter to set up testing bench.
4.    Expertise is required in power circuit design and development, especially DC/DC conversion for telecom applications.
5.    The candidate must possess analog hardware skills including specification of requirements, schematic design and schematic capture, development of test plans, and design verification testing.
6.    Experiences in the design of DC/DC converters including associated on-board primary-side power train circuitry.
7.    Experience with module-level DC/DC power supply design such as radio module embedded power supplies.
8.    Experience with secondary side on-board power (ie. buck converters) and system power, protection, and grounding requirements and design is highly desirable.
9.    The candidate must be capable of working collaboratively with external OEM vendors to achieve solutions.
10.    The candidate should be comfortable working in a hardware development lab environment.


简历发送至：recruitment.etc@ericsson.com
标题：职位名称+姓名+学校
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