Principal Activities:

Responsible for thermal related design.
Interface with a global team of thermal and mechanical design.
Work with mechanical and electrical designer for product development.
Conduct thermal simulation and thermal testing.


This engineer intern is proficient with thermal design tools and exhibits a strong understanding of the thermal design, testing, and support process.  This engineer intern will work with mechanical and electrical designers, design proper heat dissipation solutions for board level and shelf level products.



Requirements:

B.S. or Equivalent in mechanical or air dynamic Engineering.
Familiar with Pro/Engineer for modeling.
Strong experience with Icepak and Flowthom for simulation.
Design and perform thermal testing, implement test report.
Deal with board level, shelf level thermal design, cabinet level design experiences is a plus.
Familiar with fan selection and testing.
Familiar with outdoor climate design, include but not least heat exchanger, heat pipe, etc.
Understand reliability knowledge and can design proper MTBF for thermal module.
Sensitive for new thermal knowledge and application.
Strong English language communication skills.
感兴趣的同学请将您的简历发送到 recruitment.etc@ericsson.com

注意：

简历邮件命名方式：应聘Thermal design engineer intern+姓名+学校+年级+专业

请务必按照以上方式命名，谢谢~
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