Effect of Plating Condition on the Mechanical Properties and Residual Stress of Electroplated Copper Film

Journal Advanced Materials Research (Volumes 26 - 28)
Volume Advanced Materials and Processing
Edited by Young Won Chang, Nack J. Kim and Chong Soo Lee
Pages 637-640
DOI 10.4028/www.scientific.net/AMR.26-28.637
Citation Yoo Min Ahn et al., 2007, Advanced Materials Research, 26-28, 637
Online since October, 2007
Authors Yoo Min Ahn, Yong Jun Ko, Hyun Joon Kim, Dong Ho Lee, Su Kei Lee, Jae Ho Lee
Keywords Additive, CMP Dishing, Copper (Cu), Current Type, Electroplating, Residual Stress, ULSI

连接http://www.scientific.net/AMR.26-28.637

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