微信：861112547

车规大厂，办公上海，武汉，北京

封装设计工程师/经理

职位介绍
封装
Job Description:
1. Implementation of packaging layout to meet layout rule and product requirements.
2. EDA tool set up and flow development.
3. PI/SI analysis on full chip and critical IPs at package and board level.
4. Define and develop package solution for high speed, high power and large pin count device in a cross-function team
5. Interface with vendors on process optimization, chip characterization and failure analysis for volume production
6. Drive new technology development such as multi-die, CoWoS

Job Requirement:
1. bachelor degree in Electrical Engineering or related fields with 3+ years of experience.
2. Hands on experiences the following: Cadence Allegro APD & SiP tools, Sigrity XtractIM, PowerSI
3. Hands on experiences with layout of FCBGA, MCM, SiP, WLBGA etc and optimization for ball count and power grid.
4. Experience on mechanical and thermal analysis and control, knowledge on mechanical and thermal reliability is a must.
5. Experience on design of very large form factor flip chip package with high substrate layer count
6. Experience on 2.5D or 3D multi-die solutions is preferred
7. Experience with high-speed IO interfaces design and bringup such as DDR, PCIe and HBM is preferred.
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FROM 58.60.254.*